Organizing Committee

General Co-Chairs

  • Mario Gerla, UCLA, USA
  • Enzo Mingozzi, University of Pisa, Italy

TPC Co-Chairs

  • Mainak Chatterjee, University of Central Florida, USA
  • Andrea Passarella, IIT-CNR, Italy

Workshops Co-Chairs

  • Albert Banchs, University Carlos III of Madrid, Spain
  • Luciano Bononi, University of Bologna, Italy

Publications Co-Chairs

  • Daniele Puccinelli, SUPSI, Switzerland
  • Marco Di Felice, University of Bologna, Italy

Industry-track Co-Chairs

  • Marc Brogle, SAP Research, Switzerland
  • Xavier Pérez Costa, NEC Laboratories Europe, Germany

PhD Forum Co-Chairs

  • Silvia Giordano, SUPSI, Switzerland
  • Mohan Kumar, The University of Texas at Arlington, USA

Demo co-chairs

  • Falko Dressler, University of Erlangen, Germany
  • Dario Maggiorini, University of Milan, Italy

Panel Chair

  • Giorgio Ventre, Università di Napoli “Federico II”, Italy

Publicity Co-Chairs

  • Habib M. Ammari, Hofstra University, USA
  • Daniele Migliorini, University of Pisa, Italy
  • June-Koo Kevin Rhee, KAIST, Korea
  • Nirmalya Roy, Institute for Infocomm Research (I2R), Singapore

Finance & Registration Chair

  • Yonghe Liu, University Texas at Arlington, USA

Local Organization Chair

  • Adriana Lazzaroni, IIT-CNR, Italy

Web Chair

  • Carlo Vallati, University of Pisa, Italy

Steering Committee

  • Marco Conti, IIT-CNR, Italy
  • Sajal K. Das, University Texas at Arlington, USA (chair)
  • Dipankar Raychaudhuri, Rutgers University, USA
  • Satish K. Tripathi, SUNY Buffalo, USA

Technical program committee

  • Mostafa Ammar, Georgia Institute of Technology, USA
  • Giuseppe Anastasi, University of Pisa, Italy
  • Chadi Assi, Concordia University, Canada
  • Stefano Avallone, University of Naples, Italy
  • Albert Banchs, Universidad Carlos III de Madrid, Spain
  • Nilanjan Banerjee, University of Arkansas, Fayetteville, USA
  • Paolo Bellavista, University of Bologna, Italy
  • Giuseppe Bianchi, University of Rome Tor Vergata, Italy
  • Douglas Blough, Georgia Institute of Technology, USA
  • Luciano Bononi, University of Bologna, Italy
  • Azzedine Boukerche, University of Ottawa, Canada
  • Raffaele Bruno, IIT-CNR, Italy
  • Levente Buttyan, Budapest University of Technology and Economics, Hungary
  • Antonio Capone, Politecnico di Milano, Italy
  • Matteo Cesana, Politecnico di Milano, Italy
  • Hojung Cha,Yonsei University, South Korea
  • Siddhartha Chattopadhyay, Google Inc, USA
  • Sunghyun Choi, Seoul National University, South Korea
  • Kaushik Chowdhury, Northeastern University, USA
  • Claudio Cicconetti, Intecs S.p.A., Italy
  • Carlos Cordeiro, Intel Corporation, USA
  • Jon Crowcroft, University of Cambridge, United Kingdom
  • Igor Curcio, Nokia Research Center, Finland
  • Swades De, Indian Institute of Technology, Delhi, India
  • Murat Demirbas, SUNY at Buffalo, USA
  • Roberto Di Pietro, University of Rome La Sapienza, Italy
  • Magda El Zarki, University of California at Irvine, USA
  • Ozgur Ercetin, Sabanci University, Turkey
  • Serge Fdida, University Pierre & Marie Curie, France
  • Marco Fiore, INSA Lyon, France
  • Luca Foschini, University of Bologna, Italy
  • Xiaoming Fu, University of Goettingen, Germany
  • Preetam Ghosh, University of Southern Mississippi, USA
  • Silvia Giordano, University of Applied Science - SUPSI, Switzerland
  • Christos Gkantsidis, Microsoft Research, United Kingdom
  • James Gross, RWTH Aachen University, Germany
  • Ahmed Helmy, University of Florida, USA
  • Ekram Hossain, University of Manitoba, Canada
  • Stratis Ioannidis, Technicolor, France
  • Jussi Kangasharju, University of Helsinki, Finland
  • Holger Karl, University of Paderborn, Germany
  • Polychronis Koutsakis, Technical University of Crete, Greece
  • Dimitrios Koutsonikolas, Purdue University, USA
  • Mohan Kumar, The University of Texas at Arlington, USA
  • Kevin Kwiat, Air Force Research Laboratory, USA
  • Ying-Dar Lin, National Chiao Tung University, Taiwan
  • Yonghe Liu, The University of Texas at Arlington, USA
  • Petri Mähönen, RWTH Aachen University, Germany
  • Mahesh Marina, The University of Edinburgh, United Kingdom
  • Cecilia Mascolo, University of Cambridge, United Kingdom
  • Martin Mauve, Heinrich Heine University Dusseldorf, Germany
  • Martin May, Technicolor, France
  • Daniele Miorandi, Create-Net, Italy
  • Refik Molva, Insitut Eurecom, France
  • Edmundo Monteiro, University of Coimbra, Portugal
  • Giacomo Morabito, University of Catania, Italy
  • Matt Mutka, Michigan State University, USA
  • Cristina Nita-Rotaru, Purdue University, USA
  • Dusit Niyato, Nanyang Technological University, Singapore
  • Melek Önen, Insitut Eurecom, France
  • Joerg Ott, Aalto University, Finland
  • Elena Pagani, University of Milano, Italy
  • Giovanni Pau, University of California Los Angeles, USA
  • Chiara Petrioli, University of Rome La Sapienza, Italy
  • Daji Qiao, Iowa State University, USA
  • Injong Rhee, North Carolina State University, USA
  • Kay Roemer, ETH Zurich, Switzerland
  • Pedro M. Ruiz Martinez, University of Murcia, Spain
  • Alexander Sayenko, Nokia Siemens Networks, Finland
  • Shamik Sengupta, City University of New York, USA
  • Abdullatif Shikfa, Bell Labs, Alcatel-Lucent, France
  • David Simplot-Ryl, University of Lille, France
  • Vasilios Siris, ICS-FORTH / Athens University of Economics and Business, Greece
  • Raghupathy Sivakumar, Georgia Institute of Technology, USA
  • Thrasyvoulos Spyropoulos, Insitut Eurecom, France
  • Ioannis Stavrakakis, National and Kapodistrian University of Athens, Greece
  • Ivan Stojmenovic, University of Ottawa, Canada
  • Thorsten Strufe, TU Darmstadt, Germany
  • Violet Syrotiuk, Arizona State University, USA
  • Ilenia Tinnirello, University of Palermo, Italy
  • Wade Trappe, WINLAB, Rutgers University, USA
  • Damla Turgut, University of Central Florida, USA
  • Joerg Widmer, IMDEA Networks, Spain
  • Adam Wolisz, Technical University of Berlin, Germany
  • Gergely Zaruba, University of Texas at Arlington, USA
  • Cliff Zou, University of Central Florida, USA
  • Moshe Zukerman, City University of Hong Kong, Hong Kong